Processing parameters for laser micromachining

James Angell; Wen Ho; Jeffrey S. Bernstein; Ronald D. Schaeffer

doi:10.1117/12.270015

27 March 1997 Processing parameters for laser micromachining

James Angell, Wen Ho, Jeffrey S. Bernstein, Ronald D. Schaeffer

Proceedings Volume 2993, Lasers as Tools for Manufacturing II; (1997) https://doi.org/10.1117/12.270015
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

Over a period of many years a wealth of information has been accumulated on processing parameters for laser micromachining of different materials. This information includes threshold fluences, etch rates versus fluence curves, taper effects, debris minimization and assist gas effects to name a few. It is the intent of the authors to compile this empirical information into an easily accessible catalog to be used as a reference guide for those interested in laser micromachining. Information will be included on material type, lasers used in machining (carbon-dioxide, solid state, excimer), laser processing parameters (wavelength, fluence, pulse width, cutting speed) and other material related information (thickness, feature sizes, etc.).

Citation Download Citation

James Angell, Wen Ho, Jeffrey S. Bernstein, and Ronald D. Schaeffer "Processing parameters for laser micromachining", Proc. SPIE 2993, Lasers as Tools for Manufacturing II, (27 March 1997); https://doi.org/10.1117/12.270015

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