Effect of processing on the overlay performance of a wafer stepper

Peter Dirksen; Casper A. H. Juffermans; A. Leeuwestein; Kees A. H. Mutsaers; Tom A. M. Nuijs; Rudy J. M. Pellens; Robert Wolters; Jack Gemen

doi:10.1117/12.275950

7 July 1997 Effect of processing on the overlay performance of a wafer stepper

Peter Dirksen, Casper A. H. Juffermans, A. Leeuwestein, Kees A. H. Mutsaers, Tom A. M. Nuijs, Rudy J. M. Pellens, Robert Wolters, Jack Gemen

Author Affiliations +

Proceedings Volume 3050, Metrology, Inspection, and Process Control for Microlithography XI; (1997) https://doi.org/10.1117/12.275950
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

The effects of resist spinning, aluminum sputtering and chemical mechanical polishing on the observed alignment position in ASML wafer steppers are presented. Vector maps of the process induced alignment shifts are shown for various processing conditions. The deposition experiments are compared with simulations and a specially designed alignment system modeling program.

Citation Download Citation

Peter Dirksen, Casper A. H. Juffermans, A. Leeuwestein, Kees A. H. Mutsaers, Tom A. M. Nuijs, Rudy J. M. Pellens, Robert Wolters, and Jack Gemen "Effect of processing on the overlay performance of a wafer stepper", Proc. SPIE 3050, Metrology, Inspection, and Process Control for Microlithography XI, (7 July 1997); https://doi.org/10.1117/12.275950

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