Paper
5 September 1997 Characteristic analysis of basic mechanisms with large deflective elastic hinges for three-dimensional micromechanisms
Author Affiliations +
Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284532
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
In this paper, a basic mechanism of 3D micromechanisms is proposed by making use of number synthesis of mechanisms. The output point of the proposed mechanism can move in the vertical direction when two linear input points move in the inverse horizontal direction, and can move horizontal direction when two linear input points move in the same horizontal direction. The validity and the characteristics of the proposed mechanism are investigated theoretically and experimentally by using a polyethylene macromodel manufactured by a small modeling injection machine. Finally, an example of a micromechanism manufactured by semiconductor fine-machining technique is shown.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mikio Horie, Daiki Kamiya, and Kozo Ikegami "Characteristic analysis of basic mechanisms with large deflective elastic hinges for three-dimensional micromechanisms", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); https://doi.org/10.1117/12.284532
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KEYWORDS
Manufacturing

3D modeling

Semiconductor manufacturing

Semiconductors

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