Extension of high-density interconnect multichip module technology for MEMS packaging

Jeffrey T. Butler; Victor M. Bright; Richard J. Saia; John H. Comtois

doi:10.1117/12.284513

5 September 1997 Extension of high-density interconnect multichip module technology for MEMS packaging

Jeffrey T. Butler, Victor M. Bright, Richard J. Saia, John H. Comtois

Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284513
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

In this paper, we describe research into extending the General Electric chip-on-flex (COF) process for packaging microelectromechanical systems (MEMS). COF is a derivative of the high density interconnect (HDI) used for multichip module packaging of microelectronics. COF is a high performance, low cost multichip packaging technology in which die are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components. For MEMS packaging, the standard COF process has been modified to include laser ablating windows in the interconnect overlay to allow access to MEMS. Special purpose surface and bulk micromachining test die were developed and packaged with CMOS electronics using the COF process. The COF/MEMS packaging technology is well-suited for applications in which monolithic integration of MEMS and electronics is not optimal.

Citation Download Citation

Jeffrey T. Butler, Victor M. Bright, Richard J. Saia, and John H. Comtois "Extension of high-density interconnect multichip module technology for MEMS packaging", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); https://doi.org/10.1117/12.284513

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available