Planarization techniques for MEMS: enabling new structures and enhancing manufacturability

James H. Smith

doi:10.1117/12.305615

16 April 1998 Planarization techniques for MEMS: enabling new structures and enhancing manufacturability

James H. Smith

Proceedings Volume 3321, 1996 Symposium on Smart Materials, Structures, and MEMS; (1998) https://doi.org/10.1117/12.305615
Event: Smart Materials, Structures and MEMS, 1996, Bangalore, India

Abstract

Planarization techniques such as chemical-mechanical polishing (CMP) have emerged as enabling technologies for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). An overview of general planarization techniques for MicroElectroMechanical Systems (MEMS) and, in particular, the extension of CMP from sub-micron IC manufacturing to the fabrication of complex surface-micromachined MEMS will be presented. Planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. The CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressure sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics are presented.

Citation Download Citation

James H. Smith "Planarization techniques for MEMS: enabling new structures and enhancing manufacturability", Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); https://doi.org/10.1117/12.305615

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