Spinnable and UV-patternable hybrid sol-gel silica glass for direct semiconductor dielectric layer manufacturing

Mark P. Andrews; Ping Zhang; S. Iraj Najafi; Keith K. Chao; Nicholas F. Pasch

doi:10.1117/12.350178

11 June 1999 Spinnable and UV-patternable hybrid sol-gel silica glass for direct semiconductor dielectric layer manufacturing

Mark P. Andrews, Ping Zhang, S. Iraj Najafi, Keith K. Chao, Nicholas F. Pasch

Author Affiliations +

Proceedings Volume 3678, Advances in Resist Technology and Processing XVI; (1999) https://doi.org/10.1117/12.350178
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

The introduction of the hybrid sol-gel silica glass for direct semiconductor dielectric layer process involves three aspects of photolithography processes. First, the hybrid sol-gel silica glass is possible for the low k dielectric process. Second, it is also photosensitive and UV- patternable at 193 nm or shorter wavelength as the photoresists. Third, it can be used for direct dielectric process that can dramatically simplify the process flow and act as both dielectric materials and photoresist. To directly fabricate semiconductor dielectric layer by using spin-on and UV-patternable materials, to grow glass directly on the quartz, glass or even on the wafer substrate, to have photosensitive materials suitable for direct dielectric layer lithography process is in demand. With decreasing feature sizes, shorter wavelength for exposure is needed. At 193 nm wavelength, most of the materials are not transparent. Hybrid sol-gel silica glass in one of the UV- patternable materials for direct electronic device processing. It may be useful for reticle, DRAM, flat panel or even ASIC manufacturing. It can be 'formed' into intricate and precise 3D configuration. Exposure to DUV or 193 nm light result in a polymerization of the underlying sol-gel glass. the process alters the chemical properties within the bulk of the material as well as at the surface.

Citation Download Citation

Mark P. Andrews, Ping Zhang, S. Iraj Najafi, Keith K. Chao, and Nicholas F. Pasch "Spinnable and UV-patternable hybrid sol-gel silica glass for direct semiconductor dielectric layer manufacturing", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350178

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