Paper
11 August 2000 Microtensile tests with the aid of probe microscopy for the study of MEMS materials
Ioannis Chasiotis, Wolfgang G. Knauss
Author Affiliations +
Proceedings Volume 4175, Materials and Device Characterization in Micromachining III; (2000) https://doi.org/10.1117/12.395616
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States
Abstract
Mechanical tests of thin films require novel and sophisticated methods that can address the geometry and microstructure of the films. A new method of micro-tensile testing of MicroElectroMechanical Systems (MEMS) films has been demonstrated. An improved apparatus has been designed and implemented to measure the elastic tensile properties. (Young's modulus, Poisson's ration and tensile strength) of surface micromachined polysilicon specimans. The tensile specimans are dog-bone shaped ending in a large paddle for convenient electrostatic or, in the improved apparatus, UV adhesive gripping. The test section of the specimens is 400(mu) m long with 2(mu) mx50(mu) m cross section. The method employs Atomic Force Microscope (AFM) acquired surface topologies of deforming specimans to determine (fields of) strain by way of the Digital Image Correlation method (DIC). With this method, high strength of non- linearly behaving materials under different environmental conditions can be tested by measuring the strains directly on the surface of the film with nanometer resolution in in-place and out-of-plane measurements.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ioannis Chasiotis and Wolfgang G. Knauss "Microtensile tests with the aid of probe microscopy for the study of MEMS materials", Proc. SPIE 4175, Materials and Device Characterization in Micromachining III, (11 August 2000); https://doi.org/10.1117/12.395616
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Cited by 28 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Surface roughness

Adhesives

Atomic force microscopy

Ultraviolet radiation

Digital image correlation

Error analysis

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