Paper
23 August 2000 Corrective actions for stainless-steel-particle-related burn-in failures
Ana Sacedon, Jesus Inarrea, Manuel Alvarez, Pilar Prieto, Jose C. Plaza, Jose L. Hernandez, Carlos Martinez, Salvador Fernandez, Pablo S. Dominguez, Jose P. Gonzalez, Manuel Larran, Carlos Mata
Author Affiliations +
Abstract
Metal shorts are the second burn-in failure cause in our production line. Stainless Steel (SS) particles are found in most of the analyzed metal shorts. This work presents the corrective actions implemented to detect, prevent and correct SS particle sources in our production line. The SS particle corrective actions cover from in-line KLA-ADC detection, to hardware/process modification and new wafer backside contamination controls. The main sources are due to 1) the lack of some final point filters in some NEW/old machines; 2) damaged SS mobile pieces; 3) wafer backside contamination. The back-side contamination comes form SS hardware pieces that need to be replaced by other with SS-free surfaces; as the standard LAM-TCP APM-chick. A positive impact in the burn-in failure rate has bene seen after implementing those corrective actions.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ana Sacedon, Jesus Inarrea, Manuel Alvarez, Pilar Prieto, Jose C. Plaza, Jose L. Hernandez, Carlos Martinez, Salvador Fernandez, Pablo S. Dominguez, Jose P. Gonzalez, Manuel Larran, and Carlos Mata "Corrective actions for stainless-steel-particle-related burn-in failures", Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); https://doi.org/10.1117/12.410078
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Cited by 2 scholarly publications.
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KEYWORDS
Particles

Semiconducting wafers

Metals

Inspection

Contamination

Atmospheric particles

Contact lenses

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