Evaluation techniques for 300-mm equipment

Karl E. Mautz; Thomas Morgenstern; Ralf Schuster

doi:10.1117/12.410093

23 August 2000 Evaluation techniques for 300-mm equipment

Karl E. Mautz, Thomas Morgenstern, Ralf Schuster

Proceedings Volume 4182, Process Control and Diagnostics; (2000) https://doi.org/10.1117/12.410093
Event: Microelectronic Manufacturing, 2000, Santa Clara, CA, United States

Abstract

As the semiconductor industry begins its transition to its next wafer size threshold of 300mm, several key factors are becoming significant. Solving the problems surrounding these factors is critical to achieving a 30-40 percent cost savings over 200mm wafer integrated circuit manufacturing. These problematic areas involve automation, equipment readiness, and process performance. 300mm factories will differ from 200mm versions due to the automation level, lot size choices, and factory sizing targets in terms of wafer starts. This paper discusses these areas from data acquired at SEMICONDUCTOR300 in processing a 0.25 micrometers 64Mb DRAM device. Current performance is discussed for each semiconductor manufacturing tool functional group. These data include performance cost of ownership, on automation and computer integrated manufacturing, and process capability.

Citation Download Citation

Karl E. Mautz, Thomas Morgenstern, and Ralf Schuster "Evaluation techniques for 300-mm equipment", Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); https://doi.org/10.1117/12.410093

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