Electromagnetic micro x-y stage with very thick Cu coil for probe-based mass data storage device

Jaejoon Choi; Hong sik Park; Kyu yong Kim; Jong up Jeon

doi:10.1117/12.436622

16 August 2001 Electromagnetic micro x-y stage with very thick Cu coil for probe-based mass data storage device

Jaejoon Choi, Hong sik Park, Kyu yong Kim, Jong up Jeon

Proceedings Volume 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS; (2001) https://doi.org/10.1117/12.436622
Event: SPIE's 8th Annual International Symposium on Smart Structures and Materials, 2001, Newport Beach, CA, United States

Abstract

We fabricated electromagnetic micro x-y stage for application to probe based mass data storage (PDS) devices. The stage consists of Si body containing planar copper coils, glass substrate bonded to the body, and 8 permanent magnets. The dimensions of springs and copper coils were determined so that a current of 100 mA would provide 50 μm motion in x and y. For application to PDS device, electromagnetic stage should have a flat top surface and coils of low resistance. So conducting planar copper coils have been electroplated within silicon trench of high aspect ratio (5 μm in width and 30 μm in depth). As insulating layer, polyimide was used. Silicon flexures with the height of 250 μm were fabricated by using ICP-RIE (Inductively Coupled Plasma Reactive Ion Etching). The characteristics of the fabricated electromagnetic stage were measured by LDV (Laser Doppler Vibrometer) and DSA (Dynamic Signal Analyzer). DC gain was 0.16 μm/mA and the maximum displacement was 42 μm at a current of 180 mA. The natural frequency was 325 Hz.

Citation Download Citation

Jaejoon Choi, Hong sik Park, Kyu yong Kim, and Jong up Jeon "Electromagnetic micro x-y stage with very thick Cu coil for probe-based mass data storage device", Proc. SPIE 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS, (16 August 2001); https://doi.org/10.1117/12.436622

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