High-volume production cost savings methods in MEMS fabrication

Joe Brown

doi:10.1117/12.425322

30 April 2001 High-volume production cost savings methods in MEMS fabrication

Joe Brown

Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425322
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

Aligned substrate bonding has developed into high volume production solutions that meet the ever-increasing needs for fabrication and performance criteria. This presentation will update the audience on recent developments for high volume production of MEMS/MST.

Citation Download Citation

Joe Brown "High-volume production cost savings methods in MEMS fabrication", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425322

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