Microwave packaging of high-speed optoelectronic devices

Han Yang; Kaixin Chen; Wei Sun; Wei Shi; Dehui Li; Maobin Yi

doi:10.1117/12.445722

16 October 2001 Microwave packaging of high-speed optoelectronic devices

Han Yang, Kaixin Chen, Wei Sun, Wei Shi, Dehui Li, Maobin Yi

Proceedings Volume 4602, Semiconductor Optoelectronic Device Manufacturing and Applications; (2001) https://doi.org/10.1117/12.445722
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China

Abstract

We use a new impedance graded line that is backland coplanar wave-guide to design transmission line. During the permission of measurement scope on project, we can perform arbitrarily matching for 5(Omega) approximately 75(Omega) , calculated in the method of quasi-static analysis, using the microwave matching network and high-frequency encapsulation, we can improve our work frequency and effective power effectively.

Citation Download Citation

Han Yang, Kaixin Chen, Wei Sun, Wei Shi, Dehui Li, and Maobin Yi "Microwave packaging of high-speed optoelectronic devices", Proc. SPIE 4602, Semiconductor Optoelectronic Device Manufacturing and Applications, (16 October 2001); https://doi.org/10.1117/12.445722

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available