Submicron particle identification by compositional defect review using Auger analysis

Kenton D. Childs; Dennis F. Paul; Tomohiko Morohashi; Stephen P. Clough

doi:10.1117/12.475641

12 July 2002 Submicron particle identification by compositional defect review using Auger analysis

Kenton D. Childs, Dennis F. Paul, Tomohiko Morohashi, Stephen P. Clough

Proceedings Volume 4692, Design, Process Integration, and Characterization for Microelectronics; (2002) https://doi.org/10.1117/12.475641
Event: Design, Process Integration, and Characterization for Microelectronics, 2002, Santa Clara, CA, United States

Abstract

Identification of particular defects plays a key role in achieving high yields for semiconductor device processing. This can be especially significant while developing and ramping new processes and technology nodes, and during efforts to recover from yield excursions. The detection of the particle's composition provides more definitive defect identification than an image alone, and greatly enhances the ability to find and eliminate the particle source. The challenges associated with particle identification become greater as the critical particle size decrease with each technology node. These challenges also become more important as new materials, new tools and new processes are introduced. Due to its surface sensitivity and high lateral spatial resolution, Auger analysis offers a unique capability for measuring the composition of very small, thin or complex particles. Auger analyses of particles that look alike sometimes reveal that they have very different compositions, and thus different defect sources. Auger readily provides compositional identification of thin surface contamination. A combination of Auger analysis with FIB cross-sections reveals the composition of buried particles and their relative position in the device stack.

Citation Download Citation

Kenton D. Childs, Dennis F. Paul, Tomohiko Morohashi, and Stephen P. Clough "Submicron particle identification by compositional defect review using Auger analysis", Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); https://doi.org/10.1117/12.475641

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KEYWORDS

Particles

Semiconducting wafers

Silicon

Copper

Scanning electron microscopy

Oxides

Etching

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