Application of a high numerical aperture lens to visualize disbonding between metallic films and polymer substrates with SAM

Steven E. Owens; Chiaki Miyasaka; Peter J. Shull

doi:10.1117/12.543319

20 July 2004 Application of a high numerical aperture lens to visualize disbonding between metallic films and polymer substrates with SAM

Steven E. Owens, Chiaki Miyasaka, Peter J. Shull

Author Affiliations +

Proceedings Volume 5393, Nondestructive Evaluation and Health Monitoring of Aerospace Materials and Composites III; (2004) https://doi.org/10.1117/12.543319
Event: NDE for Health Monitoring and Diagnostics, 2004, San Diego, CA, United States

Abstract

Due to increased demand for design flexibility, in recent years engineers have progressively employed polymers in the design of electronics enclosures. As the circuits in these enclosures are miniaturized, dissipate more thermal energy and run at higher clock speeds, electromagnetic interference (EMI) and heat dissipation concerns become more apparent and are more problematic. The high thermal impedance of polymers slows their implementation in these situations. In addition, many electronics devices are subject to industrial and governmental regulations for EMI emission and isolation. To address these concerns it is becoming increasingly popular to apply conformal metallic films to polymer-based enclosures to increase EMI shielding and decrease thermal impedance through heat spreading. As with any coating, quality assurance of adhesion between the film and substrate is of immense importance. Without standardized testing procedures for assuring the quality of these processes, it is difficult to place them into practice. When new and alternative manufacturing processes are brought forth quality assurance is of paramount importance. The majority of existing commercial testing procedures for determination of adhesion quality for metallic films pertain to metallic substrates. This paper presents the application of a practical shear wave lens to overcome these issues. It will be demonstrated that the shear wave lens will provide sufficient resolution in this application to allow visualization of bond quality and determination of to what degree a conformal coating has been achieved.

Citation Download Citation

Steven E. Owens, Chiaki Miyasaka, and Peter J. Shull "Application of a high numerical aperture lens to visualize disbonding between metallic films and polymer substrates with SAM", Proc. SPIE 5393, Nondestructive Evaluation and Health Monitoring of Aerospace Materials and Composites III, (20 July 2004); https://doi.org/10.1117/12.543319

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
5 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Polymers

Visualization

Polymer thin films

Coating

Electromagnetic coupling

Human-machine interfaces

Acoustics

Show All Keywords

Keywords/Phrases

Search In:

Publication Years