A study on self-assembled activation by Pd/Sn colloids

Guixiang Wang; Ning Li; Guojun Dong

doi:10.1117/12.780304

31 October 2007 A study on self-assembled activation by Pd/Sn colloids

Guixiang Wang, Ning Li, Guojun Dong

Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 64234O (2007) https://doi.org/10.1117/12.780304
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China

Abstract

3-Aminopropyltriethoxysilane (APTS) was used to form self-assembled molecular layers on ABS plastics surface and changed surface electrification. The processes were investigated by X-ray photoelectron spectra (XPS). After APTS treatment, the surface has some hydroxyl group which has hydrophilicity and the contact angle of ABS surface reduced. APTS-modified ABS surface has C, O, N and Si element and the results show that APTS was bonded on ABS surface. It was turned out that N and O element formed chemical bond with the ABS surface. The outermost electron configuration of Pd²⁺ is 4d⁸5s⁰p⁰and adopted dsp²hybridization commonly. The electron wasn't filled with d orbital. O has two lone pair electrons while N has one lone pair electron, which can place the Pd vacancy orbital forming O-Pd or N-Pd σcoordinate bond. Based on XPS result, we proposed the mechanism for hydrolyzing of APTS in alcohol solution, APTS adsorbing on ABS plastics surface and its effect in activation process. After APTS hydrolyzed in water solution and forms 3-Aminopropyltrihydroxysilane which condensed in alcohol solution at 65°C and forming copolymer. The copolymer self-assembled on ABS surface and after hydrolyzing can form --O-- bond which react with Pd⁰ in succedent steps. After modification with APTS, the amount of adsorption of Pd/Sn colloids increased from 0.95mg/dm² to 1.07mg/dm².

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Guixiang Wang, Ning Li, and Guojun Dong "A study on self-assembled activation by Pd/Sn colloids", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64234O (31 October 2007); https://doi.org/10.1117/12.780304

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KEYWORDS

Palladium

Copper

Silicon

Digital signal processing

Plating

Tin

Chemical elements

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