Characterization of film cut position at wafer bevel for effective immersion lithography process

Kazuyuki Matsumaro; Miyoshi Seki; Takeshi Kato

doi:10.1117/12.813376

1 April 2009 Characterization of film cut position at wafer bevel for effective immersion lithography process

Kazuyuki Matsumaro, Miyoshi Seki, Takeshi Kato

Proceedings Volume 7273, Advances in Resist Materials and Processing Technology XXVI; 727325 (2009) https://doi.org/10.1117/12.813376
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

In ArF immersion lithography process, material surface and wafer bevel hydrophobicity is an important factor in minimizing defects and water droplet residue. The application of topcoat and topcoat-less materials has been reported to increase hydrophobicity. The hydrophobicity of wafer bevel plays an important role in the effective inhibition of the immersion fluid from leaking to the wafer backside. The hydrophobicity at the wafer bevel can be optimized through the optimization of the film edge cut height (FECH), which is defined as the distance from the film surface down to the film cut edge at the wafer bevel. Special bevel rinse modules have been introduced in track systems to control FECH with a high degree of accuracy. In this work, various types of FECH were analyzed and measured using a newly developed inspection system. Based on these results, the quantification of the FECH for all the materials analyzed was made possible. It was found that FECH changed depending on the bevel rinse condition applied. For example, wafer rotation and bevel rinse flux significantly influence FECH. These results show the possibility of controlling the FECH for optimization.

Citation Download Citation

Kazuyuki Matsumaro, Miyoshi Seki, and Takeshi Kato "Characterization of film cut position at wafer bevel for effective immersion lithography process", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727325 (1 April 2009); https://doi.org/10.1117/12.813376

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available