Paper
2 February 2012 Multigigabit optical transceivers for high-data rate military applications
Author Affiliations +
Proceedings Volume 8267, Optoelectronic Interconnects XII; 82670E (2012) https://doi.org/10.1117/12.910657
Event: SPIE OPTO, 2012, San Francisco, California, United States
Abstract
Avionics has experienced an ever increasing demand for processing power and communication bandwidth. Currently deployed avionics systems require gigabit communication using opto-electronic transceivers connected with parallel optical fiber. Ultra Communications has developed a series of transceiver solutions combining ASIC technology with flip-chip bonding and advanced opto-mechanical molded optics. Ultra Communications custom high speed ASIC chips are developed using an SoS (silicon on sapphire) process. These circuits are flip chip bonded with sources (VCSEL arrays) and detectors (PIN diodes) to create an Opto-Electronic Integrated Circuit (OEIC). These have been combined with micro-optics assemblies to create transceivers with interfaces to standard fiber array (MT) cabling technology. We present an overview of the demands for transceivers in military applications and how new generation transceivers leverage both previous generation military optical transceivers as well as commercial high performance computing optical transceivers.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Brian E. Catanzaro and Charlie Kuznia "Multigigabit optical transceivers for high-data rate military applications", Proc. SPIE 8267, Optoelectronic Interconnects XII, 82670E (2 February 2012); https://doi.org/10.1117/12.910657
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KEYWORDS
Transceivers

Connectors

Tolerancing

Vertical cavity surface emitting lasers

Interfaces

GRIN lenses

Optical communications

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