Fully integrated system-on-chip for pixel-based 3D depth and scene mapping

Martin Popp; Beat De Coi; Markus Thalmann; Radoslav Gancarz; Pascal Ferrat; Martin Dürmüller; Florian Britt; Marco Annese; Markus Ledergerber; Gion-Pol Catregn

doi:10.1117/12.917050

15 February 2012 Fully integrated system-on-chip for pixel-based 3D depth and scene mapping

Martin Popp, Beat De Coi, Markus Thalmann, Radoslav Gancarz, Pascal Ferrat, Martin Dürmüller, Florian Britt, Marco Annese, Markus Ledergerber, Gion-Pol Catregn

Author Affiliations +

Proceedings Volume 8298, Sensors, Cameras, and Systems for Industrial and Scientific Applications XIII; 82980Z (2012) https://doi.org/10.1117/12.917050
Event: IS&T/SPIE Electronic Imaging, 2012, Burlingame, California, United States

Abstract

We present for the first time a fully integrated system-on-chip (SoC) for pixel-based 3D range detection suited for commercial applications. It is based on the time-of-flight (ToF) principle, i.e. measuring the phase difference of a reflected pulse train. The product epc600 is fabricated using a dedicated process flow, called Espros Photonic CMOS. This integration makes it possible to achieve a Quantum Efficiency (QE) of >80% in the full wavelength band from 520nm up to 900nm as well as very high timing precision in the sub-ns range which is needed for exact detection of the phase delay. The SoC features 8x8 pixels and includes all necessary sub-components such as ToF pixel array, voltage generation and regulation, non-volatile memory for configuration, LED driver for active illumination, digital SPI interface for easy communication, column based 12bit ADC converters, PLL and digital data processing with temporary data storage. The system can be operated at up to 100 frames per second.

Citation Download Citation

Martin Popp, Beat De Coi, Markus Thalmann, Radoslav Gancarz, Pascal Ferrat, Martin Dürmüller, Florian Britt, Marco Annese, Markus Ledergerber, and Gion-Pol Catregn "Fully integrated system-on-chip for pixel-based 3D depth and scene mapping", Proc. SPIE 8298, Sensors, Cameras, and Systems for Industrial and Scientific Applications XIII, 82980Z (15 February 2012); https://doi.org/10.1117/12.917050

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