Paper
13 January 2012 Discharge light and carbonization distribution characteristics at XLPE-silicon rubber interface with micro-cavity in tracking failure test
L. Gu, S. Li, S. B. Wang, S. L. Lei, S. X. Liu
Author Affiliations +
Abstract
Installation of cross-linked polyethylene (XLPE) cable joint possibly introduces defects into the XLPE-silicon rubber interface, such as micro-cavity and micro-wire. Those defects greatly decrease the interfacial breakdown strength and endanger the stability of power system. However, the traditional method only measures the breakdown strength, which alone is limited and can not provide detailed information to more clearly understand the dielectric performance and tracking failure mechanism. This paper investigated the effect of micro-cavity on tracking failure by analyzing the distribution characteristics of discharge light and carbonization. Interfaces with those defects were setup by pressing together a slice of XLPE and a slice of transparent silicon rubber. A 50 Hz AC voltage was applied on a pair of flat-round electrodes sandwiched at the interface with their insulation distance of 5 mm until tracking failure occurred. The evolution of both discharge light and carbonization at the interface from discharge to the failure was recorded with a video recorder and then their channel width was analyzed with image processing method. Obtained results show that micro-cavity at an XLPE-silicon rubber interface strengthens the transportation of charge and easily leads to interfacial discharge and tracking failure. The distribution of discharge light and carbonization at the interface with micro-wire proves this.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L. Gu, S. Li, S. B. Wang, S. L. Lei, and S. X. Liu "Discharge light and carbonization distribution characteristics at XLPE-silicon rubber interface with micro-cavity in tracking failure test", Proc. SPIE 8350, Fourth International Conference on Machine Vision (ICMV 2011): Computer Vision and Image Analysis; Pattern Recognition and Basic Technologies, 83501Z (13 January 2012); https://doi.org/10.1117/12.921060
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KEYWORDS
Interfaces

Electrodes

Failure analysis

Silicon

Dielectrics

Image analysis

Image processing

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