Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA

Shuyu Li; Xiaoxiong Zhou; Xiaomei Yu

doi:10.1117/12.2038077

23 December 2013 Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA

Shuyu Li, Xiaoxiong Zhou, Xiaomei Yu

Proceedings Volume 9043, 2013 International Conference on Optical Instruments and Technology: Optoelectronic Devices and Optical Signal Processing; 90430C (2013) https://doi.org/10.1117/12.2038077
Event: International Conference on Optical Instruments and Technology (OIT2013), 2013, Beijing, China

Abstract

In this paper, we report the design and fabrication of an uncooled infrared (IR) focal plane array (FPA) on quartz substrate and the wafer-level vacuum packaging for the IR FPA in view of an optical readout method. This FPA is composed of bi-material cantilever array which fabricated by the Micro-Electro Mechanical System (MEMS) technology, and the wafer-level packaging of the IR FPA is realized based on AuSn solder bonding technique. The interface of soldering is observed by scan electron microscope (SEM), which indicates that bonding interface is smooth and with no bubbles. The air leakage rate of packaged FPA is measured to be 1.3×10^-9 atm·cc/s.

Citation Download Citation

Shuyu Li, Xiaoxiong Zhou, and Xiaomei Yu "Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA", Proc. SPIE 9043, 2013 International Conference on Optical Instruments and Technology: Optoelectronic Devices and Optical Signal Processing, 90430C (23 December 2013); https://doi.org/10.1117/12.2038077

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