Wet particle source identification and reduction using a new filter cleaning process

Toru Umeda; Akihiko Morita; Hideki Shimizu; Shuichi Tsuzuki

doi:10.1117/12.2046560

27 March 2014 Wet particle source identification and reduction using a new filter cleaning process

Toru Umeda, Akihiko Morita, Hideki Shimizu, Shuichi Tsuzuki

Proceedings Volume 9051, Advances in Patterning Materials and Processes XXXI; 90511F (2014) https://doi.org/10.1117/12.2046560
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

Wet particle reduction during filter installation and start-up aligns closely with initiatives to reduce both chemical consumption and preventative maintenance time. The present study focuses on the effects of filter materials cleanliness on wet particle defectivity through evaluation of filters that have been treated with a new enhanced cleaning process focused on organic compounds reduction. Little difference in filter performance is observed between the two filter types at a size detection threshold of 60 nm, while clear differences are observed at that of 26 nm. It can be suggested that organic compounds can be identified as a potential source of wet particles. Pall recommends filters that have been treated with the special cleaning process for applications with a critical defect size of less than 60 nm. Standard filter products are capable to satisfy wet particle defect performance criteria in less critical lithography applications.

Citation Download Citation

Toru Umeda, Akihiko Morita, Hideki Shimizu, and Shuichi Tsuzuki "Wet particle source identification and reduction using a new filter cleaning process", Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90511F (27 March 2014); https://doi.org/10.1117/12.2046560

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