Novel high sensitivity EUV photoresist for sub-7nm node

Tomoki Nagai; Hisashi Nakagawa; Takehiko Naruoka; Seiichi Tagawa; Akihiro Oshima; Seiji Nagahara; Gosuke Shiraishi; Kosuke Yoshihara; Yuichi Terashita; Yukie Minekawa; Elizabeth Buitrago; Yasin Ekinci; Oktay Yildirim; Marieke Meeuwissen; Rik Hoefnagels; Gijsbert Rispens; Coen Verspaget; Raymond Maas

doi:10.1117/12.2218936

25 March 2016 Novel high sensitivity EUV photoresist for sub-7nm node

Tomoki Nagai, Hisashi Nakagawa, Takehiko Naruoka, Seiichi Tagawa, Akihiro Oshima, Seiji Nagahara, Gosuke Shiraishi, Kosuke Yoshihara, Yuichi Terashita, Yukie Minekawa, Elizabeth Buitrago, Yasin Ekinci, Oktay Yildirim, Marieke Meeuwissen, Rik Hoefnagels, Gijsbert Rispens, Coen Verspaget, Raymond Maas

Author Affiliations +

Proceedings Volume 9779, Advances in Patterning Materials and Processes XXXIII; 977908 (2016) https://doi.org/10.1117/12.2218936
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

Extreme ultraviolet lithography (EUVL) has been recognized as the most promising candidate for the manufacture of semiconductor devices for the 7 nm node and beyond. A key point in the successful introduction of EUV lithography in high volume manufacture (HVM) is the effective EUV dose utilization while simultaneously realizing ultra-high resolution and low line edge roughness (LER). Here we show EUV resist sensitivity improvement with the use of a photosensitized chemically amplified resist PSCARTM system. The evaluation of this new chemically amplified resist (CAR) as performed using EUV interference lithography (EUV-IL) is described and the fundamentals are discussed.

Citation Download Citation

Tomoki Nagai, Hisashi Nakagawa, Takehiko Naruoka, Seiichi Tagawa, Akihiro Oshima, Seiji Nagahara, Gosuke Shiraishi, Kosuke Yoshihara, Yuichi Terashita, Yukie Minekawa, Elizabeth Buitrago, Yasin Ekinci, Oktay Yildirim, Marieke Meeuwissen, Rik Hoefnagels, Gijsbert Rispens, Coen Verspaget, and Raymond Maas "Novel high sensitivity EUV photoresist for sub-7nm node", Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 977908 (25 March 2016); https://doi.org/10.1117/12.2218936

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available