Key technology enablers for co-packaged optics

Karl Muth; Vivek Raghuraman

doi:10.1117/12.2649248

9 March 2023 Key technology enablers for co-packaged optics

Karl Muth, Vivek Raghuraman

Proceedings Volume PC12427, Optical Interconnects XXIII; PC1242703 (2023) https://doi.org/10.1117/12.2649248
Event: SPIE OPTO, 2023, San Francisco, California, United States

Abstract

The exponential growth in data center traffic which creates a need for a paradigm shift in I/O technology that meets future connectivity requirements within data centers. Silicon Photonics (SiPh) based optical interfaces significantly improve I/O density by optimizing solutions along three technology vectors independently: Packaging density, speed per lane, and number of wavelengths per channel. This paper shows the necessary technologies for a SiPh based optical I/O solution that merges mature silicon chiplet packaging and fiber connectivity to achieve the highest I/O efficiency for networking applications. An early Broadcom prototype system is demonstrated.

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Karl Muth and Vivek Raghuraman "Key technology enablers for co-packaged optics", Proc. SPIE PC12427, Optical Interconnects XXIII, PC1242703 (9 March 2023); https://doi.org/10.1117/12.2649248

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KEYWORDS

Optics manufacturing

Packaging

Silicon

Wafer-level optics

Data centers

Ecosystems

Integrated optics

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