A new 193nm inspection tool for N3 EUV mask inspection

Yian Huang; Owen Wang; Rick Lai

doi:10.1117/12.2688128

22 November 2023 A new 193nm inspection tool for N3 EUV mask inspection

Yian Huang, Owen Wang, Rick Lai

Proceedings Volume PC12751, Photomask Technology 2023; PC1275105 (2023) https://doi.org/10.1117/12.2688128
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Abstract

As EUV lithography becomes increasingly prevalent in the fabrication of advanced IC chips, the ability to provide defect-free EUV masks through reliable pattern defect inspection tools is crucial for successful high volume EUV wafer fabrication. While the existing mask pattern inspection tool is based on 193nm DUV wavelength and has been used for EUV mask production for many years, the development of actinic pattern mask inspection (APMI) tools has enhanced detection capabilities for printable defects on EUV wafers. However, both DUV-based and APMI tools are costly inspection scenarios. This study aims to evaluate the Lasertec X9ULTRA, a new 193nm EUV mask pattern inspection tool, as a more cost-effective solution for high volume N3 EUV mask making. By optimizing shading calibration conditions and improving tool optics components for illumination and speckle noise reduction, the signal-to-noise ratio (SNR) of N3 mask DOIs were enhanced. As a result, X9ULTRA has the capability to detect all printable defects of interest (DOIs) accurately through die-to-die pattern inspection, meeting the sensitivity requirement of N3 mask productions. The validation of real N3 mask productions confirmed the tool's false defect count performance also. Furthermore, the X9ULTRA tool can output full mask pattern images to TSMC in-house GPU-based image computers and data servers, allowing for the development of a TSMC in-house die-to-database defect inspection algorithm. This study identified the SNR of DOIs, the defect detection capability, and the false count performance of the in-house die-todatabase algorithm using N3 masks.

Conference Presentation

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yian Huang, Owen Wang, and Rick Lai "A new 193nm inspection tool for N3 EUV mask inspection", Proc. SPIE PC12751, Photomask Technology 2023, PC1275105 (22 November 2023); https://doi.org/10.1117/12.2688128

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KEYWORDS

Inspection

Extreme ultraviolet

Defect detection

Analog to digital converters

Calibration

Light sources and illumination

Objectives

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