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Multi-aperture optics for wafer-level cameras

J. Micro/Nanolith. MEMS MOEMS 10, 043010 (Nov 21, 2011); http://dx.doi.org/10.1117/1.3659144

Andreas Brückner, Robert Leitel, Alexander Oberdörster, Peter Dannberg, Frank Wippermann, and Andreas Bräuer

Fraunhofer Institute for Applied Optics and Precision Engineering, Albert-Einstein-Str. 7, Jena, Thueringen 07745 Germany

Wafer-level optics is considered to yield imaging lenses for cameras of the smallest possible form factor. The high accuracy of the applied microsystem technologies and the parallel fabrication of thousands of modules on the wafer level make it a hot topic for high-volume applications with respect to quality and costs. However, the adaption of existing materials and technologies from microoptics for the manufacturing of millimeter scale lens diameters led to yield problems due to material shrinkage and z-height accuracy. A multi-aperture approach to real-time vision systems is proposed that overcomes these issues because it relies on microlens arrays. The demonstrated prototype achieves VGA (Video Graphics Array, 640×480 pixels) resolution with a thickness of 1.4 mm, which is a thickness reduction of 50% compared to single-aperture equivalents. The partial images that are separately recorded in different channels are stitched together to form a final image of the whole field of view by means of image processing. Distortion is corrected within the processing chain. The microlens arrays are realized by state-of-the-art micro-optical fabrication techniques on wafer level that are suitable for a potential application in high volume, e.g., for consumer electronic products.

© 2011 Society of Photo-Optical Instrumentation Engineers (SPIE)

History
Received Jun 22, 2011
Accepted Oct 17, 2011
Revised Sep 28, 2011
Published online Nov 21, 2011
Citation
Andreas Brückner, Robert Leitel, Alexander Oberdörster, Peter Dannberg, Frank Wippermann and Andreas Bräuer, "Multi-aperture optics for wafer-level cameras", J. Micro/Nanolith. MEMS MOEMS 10, 043010 (Nov 21, 2011); http://dx.doi.org/10.1117/1.3659144

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  1. Aptina Imaging Corp., “Products,” Aptina Imaging Corp. (2010). http://www.aptina.com/products/waferlevelcameras (6 December 2010).
  2. OmniVision Technologies, “Products,” OmniVision Technologies, Inc. (2009), http://www.ovt.com/products/category.php?id=21 (6 December 2010).
  3. S. Mathur, M. Okincha and M. Walters , “What camera manufacturers want,” presented at International Image Sensor Workshop, Ogunquit, ME, June 7–10, 2007.
  4. M. Rossi , “Wafer-Level Optics for miniature cameras,” presented at SPIE Photonics Europe - Optics, Photonics and Digital Technologies for Multimedia Applications, Brussels, April 12–16, 2010.
  5. E. Wolterink and K. Demeyer, “WaferOptics mass volume production and reliability,” Proc. SPIE 7716, 771614 (2010)PSISDG007716000001771614000001.
  6. D. Daly, R. F. Stevens, M. C. Hutley and N. Davies, “The manufacture of microlenses by melting photoresist,” J. Meas. Sci. Technol. 1, 759–766 (1990).
  7. P. Dannberg, L. Erdmann, R. Bierbaum, A. Krehl, A. Bräuer, and E. B. Kley, “Micro-optical elements and their integration to glass and optoelectronic wafers,” Microsyst. Technol. 6, 41–47 (1999). [ISI]
  8. A. Lohmann, “Scaling laws for lens systems,” Appl. Opt. 28, 4996–4998 (1989).
  9. A. Brückner, J. Duparré, R. Leitel, P. Dannberg, A. Bräuer, and A. Tünnermann, “Thin wafer-level camera lenses inspired by insect compound eyes,” Opt. Express 18, 24379–24394 (2010). [MEDLINE]
  10. M. Shankar, R. Willett, N. Pitsianis, T. Schulz, R. Gibbons, R. T. Kolste, J. Carriere, C. Chen, D. Prather and D. Brady, “Thin infrared imaging systems through multichannel sampling,” Appl. Opt. 47, B1–B10 (2008). [MEDLINE]
  11. R. Horisaki, S. Irie, Y. Nakao, Y. Ogura, T. Toyoda, Y. Masaki and J. Tanida, “3D information acquisition using a compound imaging system,” Proc. SPIE 6695, 66950F (2007).
  12. G. Druart, N. Guérineau, R. Haidar, S. Thétas, J. Taboury, S. Rommeluère, J. Primot and M. Fendler, “Demonstration of an infrared microcamera inspired by Xenos Peckii Vision,” Appl. Opt. 48, 3368–3374 (2009).
  13. E. Buschbeck, B. Ehmer and R. Hoy, “Chunk versus point sampling: visual imaging in a small insect,” Science 286, 1178–1179 (1999).
  14. J. Meyer, A. Brückner, R. Leitel, P. Dannberg, A. Bräuer, and A. Tünnermann, “Optical cluster eye fabricated on wafer-level,” Opt. Express 19, 17506–17519 (2011).
  15. T. Chen, P. Catrysse, A. E. Gamal, and B. Wandell, “How small should pixel size be?,” Proc. SPIE 3965, 451–459 (2000)PSISDG003965000001000451000001.
  16. J. Duparré, F. Wippermann, P. Dannberg, and A. Reimann, “Chirped arrays of refractive ellipsoidal microlenses for aberration correction under oblique incidence,” Opt. Express 13, 10539–10551 (2005).
  17. A. Oberdörster, A. Brückner, F. C. Wippermann, and A. Bräuer, “Correcting distortion and braiding of micro-images from multi-aperture imaging systems,” Proc. SPIE 7875, 7875–7810 (2010)PSISDG00787500000178750B000001.

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