Advanced absorber and compensation repair for EUV reticles utilizing a novel e-beam-based repair technique

Joseph Rodriguez; Scott Chegwidden; Andrew Elliott; Lingxuan Peng; Dinumol Devasia; Nathan Wilcox; Safak Sayan; Andrew Ridley; Franz-Josef Eberle; Michael Budach; Chanya Nguyen; Felix Hermanns; Horst Schneider; Klaus Edinger

doi:10.1117/12.3038766

22 November 2024 Advanced absorber and compensation repair for EUV reticles utilizing a novel e-beam-based repair technique

Joseph Rodriguez, Scott Chegwidden, Andrew Elliott, Lingxuan Peng, Dinumol Devasia, Nathan Wilcox, Safak Sayan, Andrew Ridley, Franz-Josef Eberle, Michael Budach, Chanya Nguyen, Felix Hermanns, Horst Schneider, Klaus Edinger

Author Affiliations +

Proceedings Volume 13216, Photomask Technology 2024; 132160R (2024) https://doi.org/10.1117/12.3038766
Event: SPIE Photomask Technology + EUV Lithography, 2024, Monterey, California, United States

Abstract

The introduction of EUV photomasks has posed significant challenges in defect repair over the years. Defects within the unique multi-layer stack used for the reflective optics can easily lead to printing defects on the wafer. Although absorber compensation repair has been successfully demonstrated in high-volume manufacturing (HVM), it has been accompanied by several obstacles. Next-generation EUV lithography for high numerical aperture (NA) EUV photomasks is proving more difficult due to stringent requirements. The advanced scanner optics demand more precise edge control for photomask repairs, necessitating the incorporation of resist effects in the defect review process to better emulate wafer impact.

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Joseph Rodriguez, Scott Chegwidden, Andrew Elliott, Lingxuan Peng, Dinumol Devasia, Nathan Wilcox, Safak Sayan, Andrew Ridley, Franz-Josef Eberle, Michael Budach, Chanya Nguyen, Felix Hermanns, Horst Schneider, and Klaus Edinger "Advanced absorber and compensation repair for EUV reticles utilizing a novel e-beam-based repair technique", Proc. SPIE 13216, Photomask Technology 2024, 132160R (22 November 2024); https://doi.org/10.1117/12.3038766

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