Femtosecond laser ablation properties of transparent materials: impact of the laser process parameters on
the machining throughput

V. V. Matylitsky; F. Hendricks; J. Aus der Au

doi:10.1117/12.2003691

15 March 2013 Femtosecond laser ablation properties of transparent materials: impact of the laser process parameters on the machining throughput

V. V. Matylitsky, F. Hendricks, J. Aus der Au

Author Affiliations +

Proceedings Volume 8611, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XIII; 861112 (2013) https://doi.org/10.1117/12.2003691
Event: SPIE LASE, 2013, San Francisco, California, United States

Abstract

High average power, high repetition rate femtosecond lasers with μJ pulse energies are increasingly used for bio-medical and material processing applications. With the introduction of femtosecond laser systems such as the Spirit^TM platform developed by High Q Lasers and Spectra-Physics, micro-processing of solid targets with femtosecond laser pulses have obtained new perspectives for industrial applications [1]. The unique advantage of material processing with subpicosecond lasers is efficient, fast and localized energy deposition, which leads to high ablation efficiency and accuracy in nearly all kinds of solid materials. The study on the impact of the laser processing parameters on the removal rate for transparent substrate using femtosecond laser pulses will be presented. In particular, examples of micro-processing of poly-L-lactic acid (PLLA) - bio-degradable polyester and Xensation^TM glass (Schott) machined with Spirit^TM ultrafast laser will be shown.

Citation Download Citation

V. V. Matylitsky, F. Hendricks, and J. Aus der Au "Femtosecond laser ablation properties of transparent materials: impact of the laser process parameters on the machining throughput", Proc. SPIE 8611, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XIII, 861112 (15 March 2013); https://doi.org/10.1117/12.2003691

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