PDF ISBN: 9781628416695 | Print ISBN: 9781628419054
DESCRIPTION
The challenges facing the most-advanced technology nodes in the microelectronics industry can be overcome with the help of design technology co-optimization (DTCO). This mediation process aims to ensure competitive technology architecture definition while avoiding schedule or yield risks caused by unrealistically aggressive process assumptions. This Tutorial Text reviews the fundamental design objectives as well as the resulting topological constraints of a standard cell logic design flow. Cell design, placement, and routing are examined against the backdrop of ever-increasing design constraints in advanced-technology nodes.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
1.6 k1,0.125: Higher-Order Frequency Multiplication
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
2.2.2 Impact of patterning-driven design constraints
2.3 Standard Cell Layout in the Era of Double Patterning
2.4 Two Generations of Double-Patterning-Enhanced P&R
2.4.1 Color-aware placement
2.4.2 Color-aware routing
2.5 Beyond P&R: The Impact of Double Patterning on Floor Planning
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
3.6 Case Study: Design Implications of Restrictive Patterning
3.6.1 Background
3.6.2 Impact of extremely restrictive lithography on SoC design
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
4.2.5 Leaf-cell DTCO effective at N14: holistic DTCO provides further improvements
4.3 Case Study 2: Holistic DTCO at N14
4.3.1 Holistic DTCO for embedded memories
4.3.2 Holistic standard-cell DTCO
4.3.3 Holistic DTCO for analog components
4.3.4 Test chip and experimental results
4.4 Case Study 3: Using DTCO Techniques to Quantify the Scaling of N7 with EUV and 193i
4.4.1 Introduction
4.4.2 Scaling targets
4.4.3 Comparison of RET implications
4.4.4 Objectives for power, performance, and area scaling
4.4.5 Cell architecture comparison
4.4.6 Macro-level scaling assessment
4.4.7 Cell-area-limited scaling
4.4.8 Router-limited scaling
4.5 Conclusion
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.