Residual stress can affect the performance of thin-film micromachined structures and lead to curling in cantilevers as well as distortion in the frequency of resonant devices. As the origin of residual stress is dependent on the fabrication processes, a nondestructive method for characterization of residual stress independent of processes conditions is desirable for supporting the design of microcantilever-based microsystems. In this paper we present a nondestructive characterization of the residual stress within composite microcantilever beams providing valuable insights toward
predicting their deflection profile after mechanical releasing from the substrate. The approach relies on the assumption of a linear gradient stress and a quadratic deflection profile across a composite microcantilever.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.