Mr. Bernd Jahrsdoerfer Profile

Bernd Jahrsdoerfer

at Friedrich-Alexander Univ Erlangen-Nürnberg

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Proceedings Article | 17 October 2003 Paper

Laser droplet weld: an innovative joining technology opens new application possibilities

Bernd Jahrsdoerfer, Gerd Esser, Manfred Geiger, Edvard Govekar

Proceedings Volume 4977, (2003) https://doi.org/10.1117/12.479576

KEYWORDS: Laser welding, Nickel, Pulsed laser operation, Laser applications, Laser processing, Signal processing, Sensors, Metals, Signal detection, Liquids

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"Laser Droplet Welding" is an innovative joining technology. The welding is realised by a laser generated liquid metal droplet which is deposited onto the parts to be joined. The raw material is a metal wire. In conventional laser welding a gap between the parts worsens the quality of the laser welded joint substantially. Contrarily a droplet offers sufficient material to bridge gaps. Even different gap sizes can be bridged by a suitable selection of the droplet size. A further advantage is the controllable heat transfer, only given by the heat content of a single drop that is sufficient to produce a high-temperature weld. The droplet heating provides the opportunity to weld small devices, thin coatings and even heat sensitive components without negative influence on their mechanical and electrical function. It is also possible to interconnect different materials by the addition of material supplied in form of drops. With the Laser Droplet Weld it is furthermore possible to join high reflective materials. This article describes the process and the system technology as well as achieved results. It will mainly focus on the droplet detachment which influences the complete process, e.g. the heat quantity or weld splashes.

Proceedings Article | 29 June 2001 Paper

Laser-assisted fabrication of electronic circuits using the ADDIMID process

Gerd Esser, Bernd Jahrsdoerfer, Uwe Urmoneit

Proceedings Volume 4274, (2001) https://doi.org/10.1117/12.432530

KEYWORDS: Particles, Copper, Polymers, Nd:YAG lasers, Laser applications, Metals, Scanning electron microscopy, Laser processing, Excimer lasers, Gas lasers

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A novel laser-assisted technology for the additive fabrication of microelectronic circuits on three-dimensional polymer substrates (Molded Interconnect Devices, 3-D MID) has been developed. Advantages of the ADDIMID-approach are: a very short process chain, no etchants, no coatings (important on 3D substrates), industry-proven laser technology (diode-pumped Nd:YAG) and high writing velocity (greater than 600 mm/s). An essential component of the process is a special composite substrate material. The material consists of a polymer matrix containing finely dispersed microcapsules. The microcapsules are fabricated by coating micron-scaled copper powder with nano-scaled SiO₂. The SiO₂ coating provides electrical insulation of the copper particles and promotes adhesion to the polymer matrix. The microcapsules are mixed with a thermoplastic base material to form a granulate. Polymer substrates are produced by injection-molding. A laser direct-write process with galvanometric beam deflection is used to generate the circuit pattern. The laser uncovers the microcapsules and removes the SiO₂ coating. Metallic copper is exposed in the processed surface regions. The exposed copper acts as catalytic nucleation site. The circuitry is then formed by chemical copper-plating. This paper presents experimental investigations on direct writing with a CO₂- and a diode-pumped Nd:YAG-laser. Effects of variations in focus position, writing velocity, and pulse frequency are described and specified with regard to their impact on the quality of the circuit patterns. A phenomenological model of the laser direct-write process is outlined.

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