The layer-by-layer manufacturing approach utilized in additive manufacturing (AM) allows access to layers offering opportunities to embed technologies at each layer leading to 3D electronics, for example. Achieving this goal requires the coupling of multiple technologies including material extrusion 3D printing, machining, and robotic component placement & soldering. When exploited synergistically in this hybrid manufacturing (HM) approach, additional functionalities can be integrated in parts to produce multifunctional parts, or parts containing any additional functionality beyond rendering of basic shape. By combining additively manufactured dielectrics and nonconductive materials with conductors (wiring and electronics) via mechatronic equipment/tooling, the 3D printing process can be interrupted to embed and enclose sophisticated electronics within materials to produce electrically functional, end-use devices for custom and embedded sensing capability. To embed and connect electrical circuits, we developed methods for ultrasonic wire embedding and laser soldering. Laser soldering was studied to create joints on wire-wire and wirecomponent junctions. Of particular importance was the placement, spacing, and fixturing of 1608 components (1.6 × 0.8 mm) relative to adjacent wires in a butt joint configuration. Additionally, resistor-capacitor circuits were fabricated (i.e., embedded within printed polycarbonate material) in series and parallel. Both circuit variants were characterized via visual observations and impedance spectroscopy. The electrical test results demonstrated feasibility of the manufacturing approach, however, elevated failure rates of encapsulated circuitry warrant further investigation into process improvement.
Additively manufactured components, although extensively customizable, are often limited in functionality. Multi-process additive manufacturing (AM) grants the ability to increase the functionality of components via subtractive manufacturing, wire embedding, foil embedding and pick and place. These processes are scalable to include several platforms ranging from desktop to large area printers. The Multi3D System is highlighted, possessing the capability to perform the above mentioned processes, all while transferring a fabricated component with a robotic arm. Work was conducted to fabricate a patent inspired, printed missile seeker. The seeker demonstrated the advantage of multi-process AM via introduction of the pick and place process. Wire embedding was also explored, with the successful interconnect of two layers of embedded wires in different planes. A final demonstration of a printed contour bracket, served to show the reduction of surface roughness on a printed part is 87.5% when subtractive manufacturing is implemented in tandem with AM. Functionality of the components on all the cases was improved. Results included optical components embedded within the printed housing, wires embedded with interconnection, and reduced surface roughness. These results highlight the improved functionality of components through multi-process AM, specifically through work conducted with the Multi3D System.
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