KEYWORDS: Signal to noise ratio, Scanners, Thermography, Inspection, Principal component analysis, Lamps, Quartz, Infrared cameras, Cameras, Imaging systems
Thermographic inspection techniques fundamentally vary by method of heat deposition. Some systems use a short burst of energy from a flash lamp while others control the motion of a quartz lamp over the material. Both techniques have had a history of successful inspections on aircraft and boiler tubes, for example. Historically, the system used for inspections was determined by the thermographic equipment available to the researcher. This paper will compare the flash and line scan thermographic systems on Reinforced Carbon-Carbon. Reinforced Carbon-Carbon (RCC) is a brittle composite material that is found on the Space Shuttle’s nose section, wing leading edges, and chin panel. It is used to protect the orbiter’s aluminum frame from superheated air during flight. In the time since the Columbia accident, impact tests on RCC panels have been ongoing. Flash thermography has been successfully used to scan the impact site for delaminations. While the system has proven effective, it is not without limitations. A single scan yields only that section of material that is in the field of view of the infrared camera. Additionally, delaminations deep within the material may not be resolved as well as with quartz heating. A comparative study was conducted using a RCC panel with flat-bottom holes varying in diameter and depth. The panel was scanned with the Thermal Line Scanner, the Thermal Photocopier, and the Echotherm from Thermal Wave Imaging. Signal to noise ratios were calculated for the defects and used to compare the three systems. This paper will discuss the details of the study and show the results obtained from each of the three systems.
The thermal line scanner has proven to be a successful method of rapidly scanning large areas of aircraft fuselage for delaminations and metal pipes for corrosion. The limitation of this technique is with the finite depth by which flaws can be located due to the fixed distance that the thermal camera follows the moving line source. To identify deeper flaws within a material, the thermal imager and line source must have a greater separation distance so that the heat has more time to propagate through the material. Ultimately, one would want to identify flaws at any depth requiring continual scans with greater separation between the line source and imager. The Thermal Photocopier is a hybrid of the thermal line scanner. It utilizes a moving line source and a stationary infrared camera. Any one image captured by the computer shows the sample in gradient cooling due to the moving heat source. An algorithm has been developed that reconstructs full-field images of the material at specific cool down times. These frames represent various depths into the sample as the heat propagates through the thickness of the material. Therefore, an object can be analyzed from the front to the back surface for flaws using this modified thermal detection system. This system has been tested on aluminum and composite materials of varying thickness yielding results consistent with thermographic images obtained with flash and quartz lamps.
Thermoelastic and photoelastic stress analysis systems effectively provide information about the sum and difference of the principal stresses, respectively. Combining these two full-field, non-contact NDE techniques allows the individual stress components to be measured. One of the main difficulties in merging these two systems is in identifying an appropriate surface coating. Thermoelasticity demands a highly emissive surface, while photoelasticity requires a strain-induced birefringent, transparent coating with a retro-reflective backing. A number of candidate coatings that are useful for combined photoelastic and thermoelastic stress measurement have been identified, with sample results given here. Issues associated with the practical implementation of combined thermoelastic and phtoelastic stress measurement are also discussed in this paper.
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