The 2D and 3D laser direct writing using Cu nanoparticle ink were studied using a compact blue-violet semiconductor laser. The laser direct writing based on a motion controller and G-code language program on PC enabled to prepare various kinds of shaped Cu grids which can be easily designed on-demand. A Cu grid pattern was prepared on a flexible and transparent polymer substrate and applied to a stress sensor. A star-shaped grid was fabricated a polymer substrate and the performance as a stress sensor for detecting the motion of human hand devises was demonstrated toward wearable electronics. In the preliminary 3D study, we have employed the layer-by-layer formation of a 3D structure, where cycle of the spin-coating of a metal nanoparticle ink and the laser direct writing were repeated. The 3D microstructures prepared by the 3D laser direct writing using Ag and Cu nanoparticle inks suggested the possibility of a 3D interconnection.
The laser sintering employing a CW DPSS laser was applied to the fabrication of transparent conductive films using silver and indium tin oxide (ITO) nanoparticle inks. The laser sintering of an Ag nanoparticle thin film gave a transparent conductive film with a thickness of ca. 10 nm, whereas such a thin film fabricated by conventional heat treatment using an electronic furnace was insulator because of the formation of isolated silver grains during the slow heating process The influences of the laser sintering conditions such as laser scan speed on the conductivity and the transparency were studied. The laser sintering using ITO nanoparticle ink gave a high transparent conductive film by one step scanning of laser beam in air.
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