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Dr. Jaeyoung Park
at Onto Innovation Inc
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Author
Publications (1)
Proceedings Article | 3 April 2012 Paper
Defect distribution study at through silicon via (TSV) bottom by scanning white-light interference microscopy
Jeongho Ahn, Jaeyoung Park, Dongchul Ihm, Byoungho Lee, Soobok Chin, Ho-Kyu Kang, Jiyoung Noh, Peter Ko, Timothy Johnson, Namki Suk
Proceedings Volume 8324, 83241U (2012) https://doi.org/10.1117/12.917797
KEYWORDS: Semiconducting wafers, Critical dimension metrology, Microscopy, Silicon, Inspection, High volume manufacturing, Phase measurement, Electronics, Metrology, Process control
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