Integrated electro-optic modulators offer huge potential to meet communications and computations' rapidly growing bandwidth requirements. Devices based on silicon allow high-volume, low-cost CMOS fabrication, and co-integration with the CMOS circuits. They are promising candidates for mass-producible Tb/s-scale inter-rack and intra-rack interconnects. This talk will focus on our advancement of silicon-based optical modulators: (1) miniaturized all silicon MOSCAP modulators for co-packaged optics and its integration with low voltage drivers, allowing low optical power consumption of 2 pJ/bit. (2) Novel carrier absorption enhanced electro-optical modulation in MOSCAP ring resonators towards integration with ultra-low voltage (<1V) CMOS drivers; (3) Carrier depletion ring unity device for large scale and high bandwidth density error-free links; (4) Linear DC-Kerr effect dominated silicon modulators towards lidar and quantum applications.
Quantum Cascade Lasers operating between 5.7 and 5.9 μm have been integrated on to a Germanium-on-Silicon (GoS) platform by flip-chip bonding. Sensing in this wavelength region is useful for a wide range of applications from monitoring caffeine and sweeteners, to analysis of oestrogen composition, which plays an important role in the metastatic spread of breast cancer. The approach demonstrated here uses laser bars incorporating twenty-four separate laser sources. Further enhancements of this system from the first generation are presented, including real-time power monitoring of the QCL output via fibrecoupling, more efficient gratings, improved support-structures and process improvements for both the QCL and GoS.
High speed optical modulators are important for a number of applications served by silicon photonics. Here we present our recent work towards high speed free carrier accumulation based optical modulators where a high speed and efficient operation is achieved. Such silicon optical modulators typically need to be built in sub-micrometre sized waveguides which are challenging to couple light to and from. Also presented are experimental results from a buried 3D-taper that is able to couple efficiently between a waveguide of height ~1.5um and a 220nm high waveguide. Losses below 0.6dB are achieved limited by the loss of the material used.
We review our recent results on modulators and detectors for the 2μm range, which may become very relevant for future communications, and on the development of mid-IR broadband devices for sensing applications. We show Mach-Zehnder and Michelson based modulators operating at data rates up to 25 Gb/s and Ge based detectors operating up to 12.5 Gb/s. For longer wavelengths relevant for sensing applications, we present broadband waveguides and splitters, waveguide integrated bolometers, and the realisation of a mid-infrared sensor.
The interest in developing high-performance optical modulator to meet the growing demands of data processing speed has increased over the last decade. While there have been significant research efforts in developing standalone silicon modulators, works on integrating those with electronics is limited, which is necessary for the practical implementation of short-reach optical interconnects.
In contrast to previous work in the field where electronic–photonic integration was mostly limited to the physical coupling approach, we have introduced a new design philosophy, where photonics and electronics must be considered as a single integrated system in order to tackle the demanding technical challenges of this field.
In this work, I shall present our recent 100Gb/s silicon photonics transmitter, where photonic and electronic devices are co-designed synergistically in terms of device packaging, power efficiency, operation speed, footprint and modulation format.
Communication traffic grows relentlessly in today’s networks, and with ever more machines connected to the network, this trend is set to continue for the foreseeable future. It is widely accepted that increasingly faster communications are required at the point of the end users, and consequently optical transmission plays a progressively greater role even in short- and medium-reach networks. Silicon photonic technologies are becoming increasingly attractive for such networks, due to their potential for low cost, energetically efficient, high-speed optical components. A representative example is the silicon-based optical modulator, which has been actively studied. Researchers have demonstrated silicon modulators in different types of structures, such as ring resonators or slow light based devices. These approaches have shown remarkably good performance in terms of modulation efficiency, however their operation could be severely affected by temperature drifts or fabrication errors. Mach-Zehnder modulators (MZM), on the other hand, show good performance and resilience to different environmental conditions. In this paper we present a CMOS-compatible compact silicon MZM. We study the application of the modulator to short-reach interconnects by realizing data modulation using some relevant advanced modulation formats, such as 4-level Pulse Amplitude Modulation (PAM-4) and Discrete Multi-Tone (DMT) modulation and compare the performance of the different systems in transmission.
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