The success of optical interconnection for practical use is strongly dependent on the development of a sophisticated
packaging and coupling technology capable of both high coupling efficiency and easy alignment. We have developed
the photomask transfer method applying UV curable resin. This technology enables fabrication of arrayed M x N optical
patterns at one shot of UV light. It is also possible to fabricate very precise patterns by a conventional photomask. The
length/thickness of the fabricated patterns can be controlled by the thickness between the photomask and the substrate.
The maximum length reaches over 1,000μm. As applications using this method, two original devices are reviewed. One
is a chip optical device which consists of a VCSEL (vertical cavity surface emitting laser), optical rods as cores, and a
surrounding clad layer. These optical rods can be accurately fabricated on the emitting spot of the VCSEL. This VCSEL
device enables flexible packaging on OE-PWBs (opto-electric printed wiring boards). Another is a 90-degree light path
conversion device for coupling to an optical wiring on OE-PWBs. It features in hybrid comb-clad consisting of air and
polymer parts. This device has a large refractive index difference between the core and hybrid comb-clad, and enables
downsizing.
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