CONFERENCE PROCEEDINGS
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Ming-Hsun Hsieh
at United Microelectronics Corp
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Author
Publications (5)
Proceedings Article | 5 April 2007 Paper
Use of in-line AFM as LWR verification tool in 45nm process development
Ming Hsun Hsieh, Kun Ho Shi, J. H. Yeh, Ruei Hung Hsu, Mingsheng Tsai, S. F. Tzou
Proceedings Volume 6518, 651833 (2007) https://doi.org/10.1117/12.712537
KEYWORDS: Critical dimension metrology, Line width roughness, Transmission electron microscopy, Optical proximity correction, Atomic force microscopy, Error analysis, Nondestructive evaluation, Semiconductors, Line edge roughness, Scanning electron microscopy
Proceedings Article | 24 March 2006 Paper
In-line monitoring of advanced copper CMP processes with picosecond ultrasonic metrology
Ming Hsun Hsieh, J. H. Yeh, Mingsheng Tsai, Chan Lon Yang, John Tan, Sean Patrick Leary
Proceedings Volume 6152, 61522C (2006) https://doi.org/10.1117/12.660205
KEYWORDS: Copper, Picosecond phenomena, Ultrasonics, Semiconducting wafers, Chemical mechanical planarization, Polishing, Transmission electron microscopy, Metrology, Signal detection, Sensors
Proceedings Article | 24 March 2006 Paper
Using in-line AFM to monitor STI profile in 65-nm technology development
Ming Hsun Hsieh, J. H. Yeh, Mingsheng Tsai, Chan Lon Yang
Proceedings Volume 6152, 615235 (2006) https://doi.org/10.1117/12.656170
KEYWORDS: Atomic force microscopy, Transmission electron microscopy, Scanning electron microscopy, Etching, Nondestructive evaluation, Semiconducting wafers, Silicon, Oxides, Process control, Photodiodes
Proceedings Article | 9 September 2004 Paper
GaGeSb alloys for high-speed reversible phase-change optical recording
Dimitre Dimitrov, Cvetanka Babeva, Shun-Te Cheng, Wei-Chih Hsu, Ming-Hsun Hsieh, Song-Yeu Tsai
Proceedings Volume 5380, (2004) https://doi.org/10.1117/12.557103
KEYWORDS: Crystals, Antimony, Gallium, Dielectrics, Optical recording, Transmittance, Reflectivity, Germanium, Temperature metrology, Refractive index
Proceedings Article | 23 September 1996 Paper
Angular alignment for wafer bonding
Proceedings Volume 2879, (1996) https://doi.org/10.1117/12.251229
KEYWORDS: Semiconducting wafers, Wafer bonding, Optical alignment, Crystals, Anisotropic etching, Etching, Photomasks, Silicon, Wet etching, Microelectromechanical systems
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