KEYWORDS: Design for manufacturing, Manufacturing, Standards development, Process modeling, Semiconductors, Information technology, Photomasks, Electronics, Semiconducting wafers, Data processing
The category and objective of DFM production management are shown. DFM is not limited to an activity within a
particular unit process in design and process. A new framework for DFM is required. DFM should be a total solution for
the common problems of all processes. Each of them must be linked to one another organically. After passing through
the whole of each process on the manufacturing platform, quality of final products is guaranteed and products are
shipped to the market. The information platform is layered with DFM, APC, and AEC. Advanced DFM is not DFM for
partial optimization of the lithography process and the design, etc. and it should be Organized DFM. They are managed
with high-level organizational IQ. The interim quality between each step of the flow should be visualized. DFM will be
quality engineering if it is Organized DFM and common metrics of the quality are provided. DFM becomes quality
engineering through effective implementation of common industrial metrics and standardized technology. DFM is
differential technology, but can leverage standards for efficient development.
KEYWORDS: Design for manufacturing, Photomasks, Manufacturing, Design for manufacturability, Reticles, Standards development, Inspection, Optical proximity correction, System on a chip, Semiconductors
Design For Manufacturability Production Management (DFM-PM) Subcommittee has been started in succession to Reticle Management Subcommittee (RMS) in Semiconductor Manufacturing Technology Committee for Japan (SMTCJ) from 2005.
Our activity focuses on the SoC (System On Chip) Business, and it pursues the improvement of communication in manufacturing technique.
The first theme of activity is the investigation and examination of the new trends about production (manufacturer) technology and related information, and proposals of business solution.
The second theme is the standardization activity about manufacture technology and the cooperation with related semiconductors' organizations.
And the third theme is holding workshop and support for promotion and spread of the standardization technology throughout semiconductor companies.
We expand a range of scope from design technology to wafer pattern reliability and we will propose the competition domain, the collaboration area and the standardization technology on DFM. Furthermore, we will be able to make up a SoC business model as the 45nm node technology beyond manufacturing platform in cooperating with the design information and the production information by utilizing EDA technology.
KEYWORDS: Photomasks, Reticles, Data modeling, Manufacturing, Semiconducting wafers, Image processing, Standards development, Design for manufacturability, Information technology, System on a chip
We reported the Guideline(Ver. 1) of Reticle Data Management(RDM) Activity in 2001. Among we have been focused SoC(System on Chip) Business, we have been improved the efficiency over Design technology, Mask manufacturing and Wafer manufacturing. Especially, these subjects have been the lithography Cost including Reticle Cost, shorter life cycle of product, more difficult technique, lower cost and shorter total TAT from design to chip shipping. Guideline Ver 1.0 announced the standardization of interface contents over Design to Mask manufacture, and to wafer manufacture. Guideline Ver 2.0 will announce this RDM activity has been developed the optimization of a new engineering chain management in addition to the pattern data and the linkage to EDA in 2003.
KEYWORDS: Reticles, Photomasks, Manufacturing, Semiconducting wafers, Design for manufacturability, Standards development, Data modeling, Electronic design automation, System on a chip, Semiconductors
We reported the Guideline (Ver.1) of Reticle Data Management (RDM) Activity in 2001. While focusing on SoC (System on Chip) business, we have improved the efficiency in design technology, mask manufacturing and wafer manufacturing. Especially, these subjects have been the lithography costs including a reticle cost, a shorter life cycle of products, more difficult techniques, a lower cost and shorter total TAT from design to chip shipping. The Guideline Ver1.0 announced the standardization of interface contents from design to mask manufacture, and to wafer manufacture as well. According to the Guideline Ver2 in 2003, RDM activity has developed the optimization of a new engineering chain management that added the pattern data and the linkage to EDA. The unique characteristics of standardization proposed in Ver2 is that apart from standardization of the data format of the pattern data itself, expression of referencing pattern data and other additional information that are associated in case pattern data is utilized should be standardized. The difference between "expression" and "format" could be understood. These expressions include knowledge, view, property for retrieve, annotation, reference and relation about pattern data. These relations will be considered from a user's view of utilizing pattern data. The purpose of this expressions is to combine various standards relating to reticle. For example the linkage between RDM and UDM that is standardization of a data model relating to EDA tools and their applications is assumable. These two layers of standardization will make creative associations of applications possible.
KEYWORDS: Photomasks, Reticles, Data modeling, Manufacturing, Semiconducting wafers, Image processing, Standards development, Design for manufacturability, Information technology, System on a chip
We reported the Guideline(Ver.1) of Reticle Data Management (RDM) Activity in 2001. Among we have been focused SoC(System on Chip) Business, we have been improved the efficiency over Design technology, Mask manufacturing and Wafer manufacturing. Especially, These subjects have been the lithography Cost including Reticle Cost, shorter life cycle of product, more difficult technique, lower cost and shorter total TAT from design to chip shipping. Guideline Ver1.0 announced the standardization of interface contents over Design to Mask manufacture, and to wafer manufacture. Guideline Ver2.0 will announce this RDM activity has been developed the optimization of a new engineering chain management in addition to the pattern data and the linkage to EDA in 2003.
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