KEYWORDS: Design for manufacturability, System on a chip, Field effect transistors, Transistors, Instrument modeling, Manufacturing, Process control, Statistical analysis, Statistical modeling, Device simulation
Device scaling increases the impact of within-die variation or mismatch on the performance and yield of many important components of System on Chip (SoC) designs. This has created a need for accurate characterization, modeling, and simulation of mismatch. This paper provides a brief overview of the recent progress in these areas along with an example illustrating the application of these techniques to
Design for Manufacturability (DFM) of Ultra Deep Submicron (UDSM) technologies.
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