Mr. Quan Sun Profile

Quan Sun

Student at Shanghai Institute of Technical Physics

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Proceedings Article | 24 October 2017 Paper

An introduction of resistive arrays and packaging technology

Quan Sun, Dafu Liu, Haimei Gong

Proceedings Volume 10462, 104624G (2017) https://doi.org/10.1117/12.2285546

KEYWORDS: Packaging, Infrared technology, Resistors, Infrared radiation, Scene simulation

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As an important way to simulate the dynamic infrared scene, the technology of resistive arrays, especially large format resistive arrays are developing very fast. Principle of resistive arrays is introduced. The unit cell is composed by two MOS transistors, a capacitor and a resistor. The resistor is the main element to make infrared radiation by heating. Key parameters, such as temperature, frame rate, uniformity and cross-talk are used to standard to evaluate the performance of the arrays. Several methods to improve the parameters is put forward. In addition, development and current situation of the packaging technology is discussed and analyzed in this paper. At last, the technology developments of resistive arrays and packaging are summed up and an outlook of the future is provided.

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