With the introduction of EUV lithography, the control of contamination in advanced semiconductor processes has become increasingly critical. Our work is a joint effort (TU/e and VDL-ETG) and is aimed at the development of plasma-assisted contamination control strategies mainly focusing on airborne particles in a low pressure gas. We present experiments comparing the charge-to-mass ratio of single spherical micron-sized particles with that of non-spherical agglomerates thereof in the spatial plasma afterglow. It is shown that the charge-to-mass ratio of two-particle clusters deviates only 6% from that of singlets. This means that for the proposed mitigation strategy, of which the efficiency is based on the charge-to-mass ratio, it is acceptable to study the charging of spherical particles and to extrapolate the results towards non-spherical particles within a reasonable range.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.