We compression molded 50 micron thick silicone films between hot platens (150°C) and room temperature platens (23°C), under high shear flow. After molding and post-curing, a voltage ramp was used to measure dielectric strength in 72 samples, each 1 cm in diameter. Breakdown strengths ranged from 16 to 183 V/μm. Overall, the two methods yielded dielectric films with comparable breakdown strengths.
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