Micromachining materials with ultrashort pulses of light offers a new modality for processing materials that can produce a low heat-affected zone, is not wavelength dependent, has reduced contamination, produces highly repeatable results shot-after-shot, can create both micron and nanometer scale features in materials and has the ability to machine just about anything. This article will provide an overview of the processes involved in micromachining with ultrafast lasers, show how they differ from traditional methods, and discuss the future of this important technology.
Conference Committee Involvement (1)
Laser Applications in Microelectronic and Optoelectronic Manufacturing X
24 January 2005 | San Jose, California, United States
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