The high variety of image wafer inspection field

Massimiliano Barone; Matteo Fedeli

doi:10.1117/12.2622457

4 March 2022 The high variety of image wafer inspection field

Massimiliano Barone, Matteo Fedeli

Proceedings Volume 12084, Fourteenth International Conference on Machine Vision (ICMV 2021); 120840K (2022) https://doi.org/10.1117/12.2622457
Event: Fourteenth International Conference on Machine Vision (ICMV 2021), 2021, Rome, Italy

Abstract

This paper contains three different problems and solutions for detecting defects in very large-scale integration of wafer images. The goal is to explain the typical categories of wafer inspection problems: topology, device inspection, wafer analysis. Unusual and particular cases have been selected to show the high problem variety into the same wafer inspection field. This aspect implies solutions very different and specific variations of classic image analysis techniques and computer vision methods.

Citation Download Citation

Massimiliano Barone and Matteo Fedeli "The high variety of image wafer inspection field", Proc. SPIE 12084, Fourteenth International Conference on Machine Vision (ICMV 2021), 120840K (4 March 2022); https://doi.org/10.1117/12.2622457

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