Paper
14 June 1999 Improved wafer stepper alignment performance using an enhanced phase grating alignment system
Jaap H. M. Neijzen, Robert D. Morton, Peter Dirksen, Henry J. L. Megens, Frank Bornebroek
Author Affiliations +
Abstract
Processes such as chemical mechanical polishing and spin coating can result in the asymmetric deformation of alignment marks. In this paper, the effects of such asymmetric mark deformations on the accuracy of the stepper alignment system are investigate. An advanced phase grating alignment system is presented which is more robust against the above mentioned process-induced alignment deviations. The potential of the new alignment system will be illustrated with result of both numerical simulations and experimental measurements. Various process modules that are known to cause mark deformations have been investigated.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jaap H. M. Neijzen, Robert D. Morton, Peter Dirksen, Henry J. L. Megens, and Frank Bornebroek "Improved wafer stepper alignment performance using an enhanced phase grating alignment system", Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); https://doi.org/10.1117/12.350826
Lens.org Logo
CITATIONS
Cited by 7 scholarly publications and 5 patents.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Optical alignment

Semiconducting wafers

Coating

Data transmission

Chemical mechanical planarization

Aluminum

Numerical simulations

Back to Top