Thermal deformation measurement of electronic packaging component using AFM scanning moire method

Huimin Xie; Gin Boay Chai; Anand Krishna Asundi; Yu Jin; Yunguang Lu; Bryan Kok Ann Ngoi; Zhaowei Zhong

doi:10.1117/12.429567

13 June 2001 Thermal deformation measurement of electronic packaging component using AFM scanning moire method

Huimin Xie, Gin Boay Chai, Anand Krishna Asundi, Yu Jin, Yunguang Lu, Bryan Kok Ann Ngoi, Zhaowei Zhong

Proceedings Volume 4317, Second International Conference on Experimental Mechanics; (2001) https://doi.org/10.1117/12.429567
Event: Second International Conference on Experimental Mechanics, 2000, Singapore, Singapore

Abstract

The AFM scanning moire method was proposed to measure the in-plane deformation in the micrometer scale. The principle and technique for measuring in-plane deformation using AFM scanning moire method are described. This method was applied to measure the thermal deformation in a quad flat pack (QFP) electronic package at 100 degrees C. The normal strain component (epsilon) _y and the shear strain component(gamma) _xy near the die in the QFP package were measured.

Citation Download Citation

Huimin Xie, Gin Boay Chai, Anand Krishna Asundi, Yu Jin, Yunguang Lu, Bryan Kok Ann Ngoi, and Zhaowei Zhong "Thermal deformation measurement of electronic packaging component using AFM scanning moire method", Proc. SPIE 4317, Second International Conference on Experimental Mechanics, (13 June 2001); https://doi.org/10.1117/12.429567

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