Paper
22 October 2010 Alignment for double-side deep-exposure lithography tool
Ping Ma, Xiaofang Fu, Chunli Yang, Song Hu, Xiaoping Tang
Author Affiliations +
Abstract
The paper presents and discusses several prevalent methods for lithography alignment, and then describes and emphasizes the principle, mechanical structure and alignment procedure of the bottom-side alignment (BSA) system for deep-exposure lithography tool. Also, the error source degrading the precision of the alignment system is analyzed. Other related techniques and methods are provided. In the end, the aligned reticle image shows that the system is proved to be stable, reliable and capable of meeting the required precision when it is applied to DUV double-side deep-exposure mask aligner.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ping Ma, Xiaofang Fu, Chunli Yang, Song Hu, and Xiaoping Tang "Alignment for double-side deep-exposure lithography tool", Proc. SPIE 7657, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 76571W (22 October 2010); https://doi.org/10.1117/12.867698
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KEYWORDS
Optical alignment

Photomasks

Reticles

Semiconducting wafers

Lithography

Image processing

Imaging systems

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