Packaging and testing represent a good fraction of the cost of the current photonics devices. Packaging includes the complex transition from the input/output fibers to the device itself, which requires very accurate alignment, bonding, tracking while the curing process takes place, and verification of the complete assembly characteristics. Industry needs to lower the cost/increase the production rates of these devices and the answer to these needs is to automate assembly and testing. The most efficient way of achieving this is by tightly integrating image processing and analysis techniques with nanopositioning motion systems and data acquisition. The paper will provide details, results and performances of alignment systems based on these techniques.
Conference Committee Involvement (6)
Optical Interconnects XXIV
29 January 2024 | San Francisco, California, United States
Optical Interconnects XXIII
1 February 2023 | San Francisco, California, United States
Optical Interconnects XXII
25 January 2022 | San Francisco, California, United States
Optical Interconnects XXI
6 March 2021 | Online Only, California, United States
Optical Interconnects XX
4 February 2020 | San Francisco, California, United States
Optical Interconnects XIX
5 February 2019 | San Francisco, California, United States
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