Dr. Simon C. C. Hsu Profile

Dr. Simon C. C. Hsu

at United Microelectronics Corp

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Author

Publications (7)

Proceedings Article | 23 October 2015 Paper

In die mask overlay control for 14nm double-patterning lithography

William Chou, James Cheng, Alex Tseng, J. Wu, Chin Kuei Chang, Jeffrey Cheng, Adder Lee, Chain Ting Huang, N. Peng, Simon C. Hsu, Chun Chi Yu, Colbert Lu, Julia Yu, Peter Craig, Chuck Pollock, Young Ham, Jeff McMurran

Proceedings Volume 9635, 96351R (2015) https://doi.org/10.1117/12.2196794

KEYWORDS: Photomasks, Semiconducting wafers, Overlay metrology, Image registration, Double patterning technology, Lithography, Source mask optimization, Reticles, Pellicles, 193nm lithography

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Proceedings Article | 19 March 2015 Paper

Scatterometry or imaging overlay: a comparative study

Simon Hsu, Yuan Chi Pai, Charlie Chen, Chun Chi Yu, Henry Hsing, Hsing-Chien Wu, Kelly Kuo, Nuriel Amir

Proceedings Volume 9424, 942409 (2015) https://doi.org/10.1117/12.2085950

KEYWORDS: Scatterometry, Overlay metrology, Photomasks, Metrology, Scatter measurement, Semiconducting wafers, Signal processing, Front end of line, Back end of line, Optical lithography

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Most fabrication facilities today use imaging overlay measurement methods, as it has been the industry’s reliable workhorse for decades. In the last few years, third-generation Scatterometry Overlay (SCOL™) or Diffraction Based Overlay (DBO-1) technology was developed, along another DBO technology (DBO-2). This development led to the question of where the DBO technology should be implemented for overlay measurements. Scatterometry has been adopted for high volume production in only few cases, always with imaging as a backup, but scatterometry overlay is considered by many as the technology of the future. In this paper we compare imaging overlay and DBO technologies by means of measurements and simulations. We outline issues and sensitivities for both technologies, providing guidelines for the best implementation of each. For several of the presented cases, data from two different DBO technologies are compared as well, the first with Pupil data access (DBO-1) and the other without pupil data access (DBO-2). Key indicators of overlay measurement quality include: layer coverage, accuracy, TMU, process robustness and robustness to process changes. Measurement data from real cases across the industry are compared and the conclusions are also backed by simulations. Accuracy is benchmarked with reference OVL, and self-consistency, showing good results for Imaging and DBO-1 technology. Process sensitivity and metrology robustness are mostly simulated with MTD (Metrology Target Designer) comparing the same process variations for both technologies. The experimental data presented in this study was done on ten advanced node layers and three production node layers, for all phases of the IC fabrication process (FEOL, MEOL and BEOL). The metrology tool used for most of the study is KLA-Tencor’s Archer 500LCM system (scatterometry-based and imaging-based measurement technologies on the same tool) another type of tool is used for DBO-2 measurements.

Finally, we conclude that both imaging overlay technology and DBO-1 technology are fully successful and have a valid roadmap for the next few design nodes, with some use cases better suited for one or the other measurement technologies. Having both imaging and DBO technology options available in parallel, allows Overlay Engineers a mix and match overlay measurement strategy, providing back up when encountering difficulties with one of the technologies and benefiting from the best of both technologies for every use case.

SPIE Journal Paper | 2 December 2014 Open Access

Techniques for improving overlay accuracy by using device correlated metrology targets as reference

Wei Jhe Tzai, Simon C. Hsu, Howard Chen, Charlie Chen, Yuan Chi Pai, Chun-Chi Yu, Chia-Ching Lin, Tal Itzkovich, Lipkong Yap, Eran Amit, David Tien, Eros Huang, Kelly T. Kuo, Nuriel Amir

JM3, Vol. 13, Issue 04, 041412, (December 2014) https://doi.org/10.1117/12.10.1117/1.JMM.13.4.041412

KEYWORDS: Metrology, Overlay metrology, Calibration, Optical filters, Etching, Semiconducting wafers, Detection and tracking algorithms, Polishing, Chemical vapor deposition, Chemical mechanical planarization

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SPIE Journal Paper | 6 October 2014 Open Access

DongSub Choi, Tal Itzkovich, Inna Tarshish-Shapir, Eros Huang, Charlie Chen, George K. Huang, Yuan Chi Pai, Jimmy C. Wu, Yu Wei Cheng, Simon C. Hsu, Chun Chi Yu, Nuriel Amir, David Tien, Kelly T. Kuo, Takeshi Kato, Osamu Inoue, Hiroki Kawada, Yutaka Okagawa, Luis Huang, Matthew Hsu, Amei Su

JM3, Vol. 13, Issue 04, 041404, (October 2014) https://doi.org/10.1117/12.10.1117/1.JMM.13.4.041404

KEYWORDS: Metrology, Overlay metrology, Calibration, Optical testing, Etching, Inspection, Scanning electron microscopy, Imaging metrology, Electron microscopes, Measurement devices

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Proceedings Article | 21 April 2014 Paper

Innovative fast technique for overlay accuracy estimation using archer self calibration (ASC)

Simon C. Hsu, Charlie Chen, Chun Chi Yu, Yuan Chi Pai, Eran Amit, Lipkong Yap, Tal Itzkovich, David Tien, Eros Huang, Kelly T. Kuo, Nuriel Amir

Proceedings Volume 9050, 90501N (2014) https://doi.org/10.1117/12.2046670

KEYWORDS: Overlay metrology, Calibration, Metrology, Optical filters, Lithography, Semiconducting wafers, Quality measurement, Analytical research, Microelectronics, Inspection

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Proceedings Article | 21 April 2014 Paper

Innovative techniques for improving overlay accuracy by using DCM (device correlated metrology) targets as reference

Wei-Jhe Tzai, Simon C. Hsu, Howard Chen, Charlie Chen, Yuan Chi Pai, Chun-Chi Yu, Chia Ching Lin, Tal Itzkovich, Lipkong Yap, Eran Amit, David Tien, Eros Huang, Kelly T. Kuo, Nuriel Amir

Proceedings Volume 9050, 90501R (2014) https://doi.org/10.1117/12.2046671

KEYWORDS: Metrology, Overlay metrology, Calibration, Optical filters, Etching, Semiconducting wafers, Chemical mechanical planarization, Detection and tracking algorithms, Polishing, Computer simulations

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Proceedings Article | 18 April 2013 Paper

DCM: device correlated metrology for overlay measurements

Charlie Chen, George K. Huang, Yuan Chi Pai, Jimmy C. Wu, Yu Wei Cheng, Simon C. Hsu, Chun Chi Yu, Nuriel Amir, Dongsub Choi, Tal Itzkovich, Inna Tarshish-Shapir, David Tien, Eros Huang, Kelly T. Kuo, Takeshi Kato, Osamu Inoue, Hiroki Kawada, Yutaka Okagawa, Luis Huang, Matthew Hsu, Amei Su

Proceedings Volume 8681, 86812R (2013) https://doi.org/10.1117/12.2011363

KEYWORDS: Overlay metrology, Metrology, Calibration, Optical testing, Etching, Measurement devices, Scanning electron microscopy, Inspection, Lithography, Scanners

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Showing 5 of 7 publications

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