A CAD flow has been developed to modify an existing large scale chip layout to reinforce the redundant via design rules to improve the yield and reliability. The flow operates on each metal-via pair from bottom up to correct the redundant via rule violations. It divides a large complex design into cells, so that multiple process can work concurrently as if every process were working on the top level to reach the goal in a reasonable time.
Conference Committee Involvement (2)
Design and Process Integration for Microelectronic Manufacturing II
27 February 2003 | Santa Clara, CA, United States
Design and Process Integration for Microelectronics Manufacturing
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